Adhesion Solution

This technique sees multiple e₂ip HeatSeal™ layers added as adhesives within the circuit layer stack, during the construction process of membrane switches, HMI, or smart surface applications. It is a bonding system that is tested to the extreme, certified, and guaranteed to protect circuitry from specific harsh environments.

e₂ip HeatSeal™ is a proprietary fabrication process for superior lamination that is used to enhance the build and performance of all types of user interfaces, with a variety of HeatSeal™ types available. The specifics of the fabrication process are innovative and environmentally friendly by design, adding to the overall appeal of HeatSeal™. Manufactured with rigorous testing, this method results in a completely sealed switch, effectively helping to eliminate one of the major causes of mechanical failure – inadequate sealing.

HeatSeal™ offers custom products containing a smarter and safer bonding system solution that remains cost-effective and offers a wide range of options for build and function support.

Another bonding system offered within our adhesive product category is the Pressure Sensitive Adhesive (PSA). 

PSA is a pressure-enabled bonding substrate that needs no heat, water, or another solvent to activate the adhesive properties. In the case of HMI, PSA is used to fuse the layers of an HMI assembly. Electrically conductive adhesives are solder-free and support assemblies by not only bonding components together but also allowing for the passing of electrical currents.