Industrial Adhesive for HMI Assemblies

The original equipment manufacturers (OEMs) that represent e₂ip’s customer base create a wide range of products, each with varying applications. Regardless of their application, each requires a reliable user interface.

Our expertise working with a variety of industrial adhesives for use in HMI assemblies (such as pressure-sensitive adhesives (PSAs) and electrically conductive adhesives) has led to the development of our own proprietary adhesive solution: HeatSeal™. How does it work?

PSAs are pressure-enabled bonding substrates that do not require heat, water or any type of solvent to activate the adhesive properties. For HMI applications, PSAs are used to fuse the layers of an HMI assembly using solder-free, electrically conductive adhesives. They help achieve solid material bonding, while still allowing contact surfaces to pass electrical currents.

e₂ip HeatSeal™ is a proprietary fabrication process for superior product lamination used to enhance the build quality and performance of a number of user interfaces.

Thanks to low melt-point adhesive bonding technology, HeatSeal™ creates industrially-sound membrane switches and circuit layer assemblies for a wide range of applications, budgets and robustness requirements.

Using an innovative and environmentally friendly manufacturing process, HeatSeal™ protects circuitry from harsh environments, effectively eliminating mechanical failure from inadequate sealing

Manufactured with rigorous testing, HeatSeal™ offers custom projects containing a smarter and safer bonding system solution that remains cost effective and offers a wide range of options for build and function support.

HeatSeal™ offers custom products containing a smarter and safer bonding system solution that remains cost-effective and offers a wide range of options for build and function support.

Another bonding system offered within our adhesive product category is the Pressure Sensitive Adhesive (PSA).

PSA is a pressure-enabled bonding substrate that needs no heat, water, or another solvent to activate the adhesive properties. In the case of HMI, PSA is used to fuse the layers of an HMI assembly. Electrically conductive adhesives are solder-free and support assemblies by not only bonding components together but also allowing for the passing of electrical currents.

Conventional pressure-sensitive adhesives, often used in membrane switch designs, cannot withstand environmental factors such as water, moisture or chemical ingress.

However, when combined with moisture barrier materials, HeatSeal™ offers the most reliable and robust switch lamination for printed electronics available on the market today. It is a 100% HeatSeal™ bonding system solution.

Using multiple HeatSeal™ layers during the construction process of membrane switches creates a bond of outstanding strength and durability. It is a bonding system that is tested to the extreme, certified and guaranteed to protect circuitry from damage done by even the harshest environments.