Molecular Ink (MINK)

By binding polymers and conductive materials together, the end result is an electrically conductive ink. This enables sleeker, smarter designs where these specialized inks can replace bulky traditional circuit boards in electronic devices.

The fabrication process is simpler, offering manufacturers a smaller ecological footprint and enhanced design flexibility to provide an effective and affordable alternative to electronic components, making it a game-changer for designers seeking to create innovative and high-performance products. With electrically conductive ink, electronic devices can be designed with more attention to aesthetics and ergonomics, allowing for a more seamless integration of features.

e₂ip products are at the forefront of printed electronics, utilizing a variety of conductive inks such as nanoparticle inks, flake inks, and their patented molecular ink (MINK), developed in collaboration with the National Research Council of Canada (NRC). The e₂ip team is committed to providing optimal solutions for each application by determining the most suitable ink selection based on the design requirements. By leveraging the unique properties of each ink type, e₂ip products offer unparalleled flexibility, durability, and performance, making them an ideal choice for a wide range of electronic applications.

Silver conductive ink has been used in our flexible circuits and is ideal due to the high electrical conductivity of silver ink and the high resistance to oxidation of silver inks. Flake inks offer similar benefits at a slightly lower conductance and flexibility.

MINK, an entirely new family of patented ‘molecular ink’ for printed electronics, is based on ionic molecules derived through a reduction process, the ink allows to produce conductive traces in which key differentiators are high conductivity, elongation, formability, and flexibility. It is compatible with various printing techniques such as screen printing, flexography, rotogravure, reverse lithography, and aerosol jet, and applications include Smart Structural Surfaces™ (IME), 5G Smart Surfaces, printed antennae, and sensors.