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The world today simultaneously demands designs with increased functionality in a physically smaller form factor. In many ways, the emergence of conductive inks has been a transformational innovation for printed electronics by delivering the design freedom to meet these demands. e2ip in collaboration with the National Research Council of Canada (NRC), has been funding development in printed electronics. This work is resulting in the invention of new Molecular inks, that resolve limitations of traditional flake inks when formed into 3D shapes.
By binding polymers and conductive materials together, the end result is ink that can conduct electricity. This enables sleeker, smarter designs where these specialized inks can replace bulky traditional circuit boards. The fabrication process is simpler, offering manufacturers a smaller ecological footprint, enhanced design flexibility, and are an effective and affordable alternative to electronic components – overall a very appealing material option.
e2ip products use a variety of conductive inks including nanoparticle inks, flake inks and most notably the patented molecular ink (MINK) invented in collaboration with the National Research Council of Canada (NRC). Our team will determine the optimal ink selection based on the design of each application.
Silver molecular ink has been used in our flexible circuits and are ideal due to the high electrical conductivity of silver and its high resistance to oxidation. Flake inks offer similar benefits at a slightly lower conductance and flexibility.
MINK, an entirely new family of patented ‘molecular ink’ for printed electronics, was developed by e2ip in partnership with the NRC. Based on ionic molecules derived through a reduction process, the ink allows to produce traces in which key differentiators are high conductivity, elongation, formability, and flexibility.
It is compatible with various printing techniques such as screen printing, flexography, rotogravure, reverse lithography, and aerosol jet, and applications include Smart Molded Parts (IME), 5G Smart Surfaces, printed antennae, and sensors.
Electronics should not get in the way of design freedom.
For more information, contact our team.
