Discover the Power of HeatSeal™
Reliability Engineered into Every Layer
When performance, durability, and protection matter, HeatSeal™ delivers. Developed by e2ip technologies, this proprietary fabrication process uses advanced low melt-point adhesive bonding to create membrane switches and circuit assemblies that can operate in even the harshest conditions.
Engineered for environments where up time is crucial, HeatSeal™ ensures permanent sealing, electrical integrity, and customizable construction—all while remaining cost-effective. Its unique process results in waterproof membrane switch and dustproof switch bonding performance, ideal for extreme temperatures, high humidity, and chemical exposure.
In this technical whitepaper, you’ll gain insights into:
- How HeatSeal™ technology withstands real-world stressors: Including temperature extremes, liquid cleaners, gasoline exposure, and high-pressure environments.
- The science behind the bond: Understand the materials, bonding techniques, and design principles that make HeatSeal™ reliable for critical applications.
- Performance you can measure: See test data and results across temperature endurance, chemical resistance, and ESD protection.
- Construction options for flexibility and strength: Explore how HeatSeal™ adapts to your design needs without compromising durability or performance.
- Why PSA-based switches fall short—and how HeatSeal™ sets a new standard.
Fill out the form to access your free guide and discover why engineers trust HeatSeal™ to protect their most sensitive and demanding interface designs.