Industrial Adhesive for HMI Assemblies

The original equipment manufacturers (OEMs) that represent e₂ip’s customer base create a wide range of products, each with varying applications. Regardless of their application, each requires a reliable user interface.

Our expertise working with a variety of industrial adhesives for use in HMI assembly applications (such as pressure-sensitive adhesives (PSAs) and electrically conductive adhesives) has led to the development of our own proprietary adhesive solution: HeatSeal™. With this innovative adhesive solution, OEMs can achieve the reliability their user interfaces need.

e₂is a proprietary fabrication process for superior product lamination used to enhance the build quality and performance of a number of user interfaces.

Thanks to low melt-point adhesive bonding technology, HeatSeal™ creates industrially-sound membrane switches and circuit layer assemblies for a wide range of applications, budgets and robustness requirements.

Using innovative and environmentally-friendly production processes, HeatSeal™ protects circuits from harsh environments, effectively eliminating mechanical failure from inadequate sealing.

Due to how rigorously it is tested, HeatSeal™ also provides solutions for custom projects that require a smart and secure, yet cost-effective bonding system. The versatility HeatSeal™ opens up an array of options to support various building and functional requirements.

HeatSeal® offers custom products containing a smarter and safer bonding system solution that remains cost-effective and offers a wide range of options for build and function support.

Another bonding system offered within our selection of versatile adhesive solutions is the Pressure Sensitive Adhesive.

PSAs are pressure-enabled bonding substrates that do not require heat, water or any type of solvent to activate the structural adhesive properties. In the manufacturing process of HMIs, PSAs are used to fuse the layers of an HMI assembly using solder-free, electrically conductive adhesives. They help achieve solid material bonding, while still allowing contact surfaces to pass electrical currents.

Conventional pressure-sensitive adhesives (PSAs), often used in membrane switch designs, cannot withstand environmental factors such as water, moisture or chemical ingress.

However, when combined with moisture barrier materials, HeatSeal™ offers the most reliable and robust switch lamination for printed electronics available on the market today. It is a 100% HeatSeal™ bonding system solution.

Using multiple HeatSeal™ layers during the construction of membrane switches establishes a remarkably strong and durable bond. This bonding system undergoes rigorous testing in the most challenging conditions, earning certification and a guarantee to safeguard circuitry from potential damage caused by the harshest environmental factors. The integrated temperature resistance ensures the protection remains effective even in extreme conditions.