Electronics and everyday life are no longer discernible. If you can touch it, printed electronics can connect it – seamlessly. If you can imagine it, we can integrate it, and we do so with the most innovative methods and materials available.
Form-fitting and energy-optimized, flexible hybrid electronics (FHE) technology is found everywhere from wearables to smart buildings. The technology is comprised of highly specialized inks made of carbon-based compounds and conformable substrates such as plastic, silicon and flexible glass.
Discover Our Printed Electronics Technologies
The future of HMI.
Save space, energy and costs.
Intuitive, ergonomic, light, thin and flexible, Capflex™ is printed keypad technology which integrates a capacitive sensor with a backlighting system. Ruggedized for the real world and finished for the future, Capflex™ delivers crisp light.
Combining in mold decoration process with printed electronics, In Mold Electronics (IME) transforms control panels into smart, curved surfaces. Featuring proximity sensors and capacitive technology, this is true experiential design captured in elegant, minimalistic style. IME is the future of HMI.
Printed PTC Heaters use Positive Temperature Coefficient (PTC) ink to generate heat up to a specific, self-regulating temperature. This design makes them not only smart, requiring no external controller mechanism, but also incredibly safe with no possibility of overheating. Save space, energy and costs.
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A new family of molecular inks for printed electronics produced in partnership with the National Research Council of Canada (NRC). Based on ionic molecules processed through a reduction process, high-speed printing methods are used to produce sub-micron trace thicknesses that bind strongly to substrates and are highly flexible.
Developed in collaboration with the National Research Council of Canada (NRC) our EES technology enhances wireless applications by filtering, blocking or reflecting radiofrequency (RF) signals. Designed for use in both indoor and outdoor environments, EES transforms walls, panels, ceilings, floors and other surfaces into RF-active surfaces. Being characteristically light, thin and flexible, EES applications are versatile and ready for optimized integration.
e2ip is focused on innovation and scientific research, striving to extend its intellectual property portfolio and continuously develop leading edge technologies.
